High Speed Digital Test Forum 2025

High-Speed Digital Test Forum 2025

Date
Date

April 8, 2025

Register now
Pays
Pays

Rohde & Schwarz GmbH & Co. KG
Mühldorfstraße 15
81671 München

High Speed Digital Test Forum

High-Speed Digital Test Forum 2025 – the Munich face-2-face edition

Digitalization is everywhere, in AI, data centers, industry automation, wireless communication, aerospace & defense, autonomous driving and many other areas. But what does this mean for development and testing?

Join our High-Speed Digital Test Forum to

  • learn about industry trends and related technologies
  • learn about challenges, solutions and best practices in Signal Integrity and Power Integrity Test
  • connect with industry experts from Rohde & Schwarz, Granite River Labs, Fixture Solution and Texas Instruments
  • exchange experiences with other participants

Sounds interesting to you? Then take the opportunity and register now!

We will particularly address the following key aspects:

Signal Integrity: Interface Test

Signal Integrity: Interface Test

Standardization bodies, like USB-IF, OPEN ALLIANCE, JEDEC and others, define the Signal Integrity requirements for proper operation of these interfaces. We will discuss evolution and electrical compliance requirements for USB, Automotive Ethernet, DDR, MIPI and DisplayPort and how to debug and optimize, when compliance fails.

Signal Integrity: PCB and Interconnect Test

Signal Integrity: PCB and Interconnect Test

PCBs and interconnects have a high influence on the Signal Integrity of the transmission channel. To connect the test equipment, test fixtures or probes are needed. We will provide insights to accurate test fixture characterization and de-embedding and the in-depth analysis of high-speed transmission channels with multiple signal lanes.

Power Integrity Test

Power Integrity Test

Disturbances on power rails cause power supply induced jitter and amplitude noise. Good Power Integrity is key for good Signal Integrity. We will discuss multiphase buck converter-based architectures for providing high currents and the related measurement solutions to verify Power Integrity in static conditions as well as in dynamic load step scenarios.

Agenda
Time Title Presenter
08:00 - 09:00 Check-in

09:00 - 09:30

Welcome and Keynote
Global digitalization, big data and AI: drivers, trends, opportunities and new design challenges:
Digitalization is everywhere and with this the demand for increasing processing power and data rates. This applies for data centers and AI, but also for many other areas like autonomous driving, industry automation, aerospace & defense and wireless communication. We will explore major trends and the evolution of the related technologies and will discuss the impact on high-speed designs and their power distribution networks as well as the increasing challenges in signal integrity and power integrity.
  • Martin Stumpf, Segment Manager High-Speed Digital Test, Rohde & Schwarz
  • Kristof Mommen, General Manager & Vice-President of Business Development, Granite River Labs EMEA

09:30 - 10:15

Power designs for high-speed SOCs with Multi-Phase Buck Converters:
The increasing complexity of high-speed system-on-chips (SoCs) and FPGAs poses significant challenges for power design. As functionality and processing power rise, so do the demands on power management. This necessitates the use of multiple power rails and innovative power supply architectures, such as multiphase buck converters. While these converters offer advantages, they also introduce new design and validation complexities, particularly for high-current power rails. Rohde & Schwarz oscilloscopes, equipped with advanced analysis capabilities, can effectively support the testing and analysis of these intricate power designs, allowing engineers to precisely measure and validate the performance of multiphase buck converters.
  • Tim Paasch-Colberg, Product Manager, Rohde & Schwarz
  • Korbinian Schmidt-Sommerfeld, Application Engineer, Rohde & Schwarz
  • Jürgen Neuhäusler, Senior Applications Engineer, Texas Instruments
10:15 - 10:45 Coffee Break

10:45 - 11:45

USB3.2 Interfaces: Signal Integrity Analysis & Compliance Testing:
This class is aimed at engineers who test & debug USB interfaces. In particular, we will discuss the details of USB 3.2 Gen 1 and Gen 2 electrical compliance testing. During the session, you will gain insight into the requirements and test setups for transmitter (Tx) and receiver (Rx) tests, covering topics such as spread spectrum clocking, jitter and eye diagram analysis, pre-shoot/de-emphasis, and more. We will examine potential sources of failure if the compliance check fails and discuss the use of tools to help identify the root causes of compliance failures.
  • Johannes Ganzert, Senior Application Engineer, Oscilloscopes, Rohde & Schwarz
  • Pascal Berten, Laboratory Director, Granite River Labs EMEA

11:45 - 12:45

Automotive Ethernet: The key to unlocking zonal architecture:
As the automotive industry looks to developing the future software defined vehicle (SDV), increased levels of autonomous driving requiring more sensors and increased connectivity brings forth challenges of transporting and processing a huge amount of data in the vehicle. To do this in an efficient way, it is necessary to reduce In-Vehicle Network complexity, power consumption and weight, leading to a change from domain-orientated network architecture to zonal architecture. This session focuses on such trends and significant development in In-Vehicle Networks such as 10Base-T1S and MultiGig speeds and how to test these new networks effectively.
  • Jithu Abraham, Product Manager, Oscilloscopes, Rohde & Schwarz
  • Rainer Eckelt, Global Director Automotive, Granite River Labs
12:45 - 13:45 Lunch Break

13:45 - 14:30

DDR Memory Interfaces: Signal Integrity Analysis & Compliance Testing:
The integration of DDR and LPDDR devices in systems often causes challenges for signal and power integrity. We will provide an overview about DDR technologies and key parameters for testing. Learn about effective tools for debugging and characterization as well as automated test solutions for conformance verification. Another challenge for DDR testing is the connectivity via interposers. See on a practical example how to de-embed the effects of the interposer correctly and utilize the power of debugging tools such as Zone Trigger or Read/ Write decoding for eye diagram analysis.
  • Guido Schulze, Product Manager, Oscilloscopes, Rohde & Schwarz
  • Johannes Ganzert, Senior Application Engineer, Oscilloscopes, Rohde & Schwarz

14:30 - 15:00

MIPI D-PHY: Signal Integrity Analysis & Compliance Testing:
The MIPI D-PHY interface was originally developed to enable high-speed data transmission between cameras and displays in mobile phones. Today, it has gained widespread adoption in automotive, consumer and industrial applications. Learn about the MIPI D-PHY interface architecture and key parameters of the physical layer. We will provide an overview of the specified conformance tests, highlight challenges unique to these tests and discuss recommended measurement setups. In case of failures, effective tools such as the Advanced Eye Diagram Analysis and Jitter Decomposition can be used to troubleshoot efficiently.
  • Guido Schulze, Product Manager, Oscilloscopes, Rohde & Schwarz
  • Alessandro Cappelletti, Senior Application Engineer - Oscilloscopes, Rohde & Schwarz
  • Pascal Berten, Laboratory Director, Granite River Labs EMEA

15:00 - 15:30

Testing DP 1.4a Sources with oscilloscopes - PHY layer compliance:
We are going to explore DisplayPort 1.4a physical layer compliance testing for high-speed digital design. After a technology overview and compliance test requirements, we demonstrate how the RTP oscilloscope can streamline verification. Learn how to debug with signal integrity tools like eye diagram analysis, and pinpoint issues by using jitter and noise decomposition utilities. Practical examples illustrate effective troubleshooting for reliable compliance.
  • Alessandro Cappelletti, Senior Application Engineer - Oscilloscopes, Rohde & Schwarz
15:30 - 16:00 Coffee Break

16:00 - 16:45

Accurate test fixture characterization and de-embedding for correct measurements with oscilloscopes and VNAs in high-speed digital applications:
Modern oscilloscopes and VNAs can mathematically remove, i.e. de-embed the lead-ins to the DUT (e.g. test fixtures, probes, etc.) and measure the correct DUT performance at the defined reference planes. This is done by modelling the lead-in via a Touchstone file. We will discuss the various use cases, the method of impedance corrected de-embedding to generate accurate lead-in models with a VNA and share best practice experience.
  • Jörn Pfeifer, Application Engineer Vector Network Analysis, Rohde & Schwarz
  • Pascal Berten, Laboratory Director, Granite River Labs EMEA

16:45 - 17:30

Characterizing the High-Speed Transmission Channel – Measurement Challenges and Advanced Test Tools:
High-speed PCB/interconnect design and validation testing poses significant challenges with increasing data rates. Characterizing transmission channels requires higher frequency testing and multi-port setups to effectively analyze the lane-to-lane crosstalk. This presentation shows various use cases as example. Key concerns for achieving accurate and time-efficient measurements are addressed by using specialized tools such as Time Domain and Enhanced Time Domain Analysis, Multiport S-Parameter SNP Assistant, and R&S®ZNrun Cable Compliance Test Automation.
  • Bryant Hsu, Product Manager, Rohde & Schwarz

Our presenters

  • 1Jithu Abraham
  • 2Alessandro Cappelleti
  • 3Johannes Ganzert
  • 4Bryant Hsu
Jithu Abraham

Product Manager Oscilloscopes, Rohde & Schwarz

Jithu works as a worldwide product manager for Rohde & Schwarz in the Oscilloscope division, specializing in Ethernet, Automotive Ethernet, PCIe and other Automotive IVN & SerDes technologies. He enjoys all aspects of high-speed digital from design, validation and debug phases and all the challenges they bring. Having over 15 years of experience in T&M, he is passionate to work with standard bodies such as Open Alliance and further the development of accurate and reliable T&M devices.

Our presenters

  • 1Tim Paasch-Colberg
  • 2Jörn Pfeiffer
  • 3Korbinian Schmidt-Sommerfeld
  • 4Guido Schulze
Tim Paasch-Colberg

Product Manager, Rohde & Schwarz

Tim Paasch-Colberg, a senior product manager at Rohde & Schwarz, specializes in aligning business and technology to drive strategy execution in matrix organizations. He focuses on market trends and customer-centric solutions across electronics, telecom, and research sectors. Skilled in global product launches and lifecycle management, he has led marketing, product development, and growth initiatives to foster innovation and customer satisfaction. Paasch-Colberg holds a PhD in Physics with expertise in quantum optics and ultrafast laser technologies.

Our presenters

  • 1Pascal Berten
  • 2Rainer Eckelt
  • 3 Jürgen Neuhäusler
Pascal Berten

Laboratory Director, Granite River Labs EMEA

Pascal is a globally recognized expert in USB testing and has more than 20 years of experience working closely with standards organizations such as USB-IF, MIPI Alliance, and others to develop new specifications.

Date: April 8, 2025
Place: Rohde & Schwarz GmbH & Co. KG, Technology Center
Entrance Mühldorfstr. 20, 81671 Munich Google Maps

Register now and save the date so you don't miss this exciting event. Be aware that seats are limited and will be allocated on a first come, first served basis. The seminar is free of charge for all registered attendees.

How to get there:

Public transportation:
Via S-Bahn, U-Bahn or Tram: Station Ostbahnhof; 8-minute walk to entrance R&S
Via bus: Muehldorfstrasse stop for line 59 or Sank Pius stop for line 146
MVV Information

Car Parking:
Guest parking slot: Muehldorfstrasse 15

Event partners:

GRL
Texas Instruments
Fixture Solution