Your Rohde & Schwarz recruiting team is looking forward to receiving your application.
The Rohde & Schwarz technology group is among the trailblazers when it comes to paving the way for a safer and connected world with its
leading solutions in test & measurement, technology systems, networks and cybersecurity.
We are looking for a highly motivated Lead ASIC Design Engineer for our North American R&D Center in Hillsboro, Oregon.
Our team is designing the next generation data converters for our world class test equipment. This is a small team environment in a great location,
that has a history of very successful devices that have been designed into our industry leading test and measurement equipment. You’ll find our
System on Chip (SoC) solutions embedded in R&S instruments in labs all over the world.
Our R&D office is located in Hillsboro, west of Portland, Oregon. We have a light, quiet and modern work environment in a new building. This is a
hybrid work position. We believe in the close personal interactions that are needed for a successful team, but understand that people occasionally
need to work from home. Fully remote work is not an option for this role.
Your tasks
- • Manage large analog block / full-chip schematics to ensure correct connectivity and functionality. • Assist layout floor-planning efforts at a high-level. • Design and implement high speed analog/mixed-signal circuits in advanced CMOS/BiCMOS technology for integration in high performance mixed-signal SoCs. • Clearly communicate with team members the various requirements or design conflicts. • Design, simulate, analyze, model, document and communicate integrated circuit IP. • Understand system level design requirements as applied to integrated circuit design. • Characterization and debugging of analog IC designs for testing and measurement equipment.
