On-wafer testing

Wafer and die testing

RF probing for on-wafer and die testing

The modern world relies on connectivity - both wired and wireless. Chips, particularly RF chips, enable this connectivity. RF chips are continuously supporting more features, functions and frequency bands. A complex RF chip will often include different functions and semiconductor technologies as a system in package (SIP).

When verifying the features of each element and semiconductor, testing is performed to verify individual function blocks before costly integration and packaging. During the production process, early testing is conducted on the wafer or die.

Rohde & Schwarz provides cutting-edge instruments that ensure fast and accurate on-wafer and die testing. We also collaborate with leading probe station specialists for sophisticated RF probing.

Your on-wafer testing challenges

RF probing using probe stations is applied in different stages of the product design, verification and production. Integration of test instrumentation and probing is essential in all cases.

The follow tasks apply to development and design verification:

• Flexible verification of the wafer or die on a manual or semi-automated probe station
• Special vector calibration for S parameter and further RF measurements
• Integration of frequency converters or RF frontends on the prober to avoid loss for millimeter and THz applications
• Combination of RF and DC for active devices

It is important to note that active components require special caution because cooling is not available the way it is in a final design.

In production:

• Fast verification by synchronized interaction between probe station and test instrumentation
• Parallel testing with multisite probing and frequency offsets to avoid crosstalk
• Reduction of touch-downs to avoid any damage to the device

High-performance solutions for on-wafer testing

Rohde & Schwarz offers solutions for every stage of on-wafer testing - from development to production.

Browse our portfolio and discover:

• The performance vector network analyzer R&S®ZNA: all the features necessary to verify active and passive components at both the wafer and die levels
• Millimeter converters in the R&S®ZC family: an extended frequency range up to 1.1 THz for researching terahertz frequencies
• The multiport vector network analyzer R&S®ZNBT: speed optimized with parallel testing with up to 24 ports, ideal for mass production
• External frontends R&S®FE170: wideband up-conversion for modulation test on-wafer next to the probe and compact integration within probe stations

We also work closely with partners to develop comprehensive solutions for probing as well as load-pull and impedance matching.

• Probing for on-wafer and die testing: integration of Rohde & Schwarz vector network analyzers with probe systems from MPI Corporation and FormFactor
• Load-pull and impedance matching: use of tuners from Maury Microwave and Focus Microwaves